Description

PCB Capability:�
Max Layer Count for rigid PCB: ***2�
PCB Board Thickness: *4mil ***5mil�
Drill to Metal: 7mil�
Hole Size: 6mil�
Inner layer Registration: 3mil�
Line Width & Space Inner/Outer: 3mil/3mil (minimum)�
Aspect Ratio: Min Solder mask Dam: 2.5mil�
Controlled Impedance: +/- 8%�
Max Internal Copper Wt.: 3 oz�
Advanced Technologies: Blind/Buried Via, HDI Micro via�
Surface Treatment: ENIG, OSP, Immersion Silver/Tin, Lead free HAL�
Materials: FR4, High Tg Epoxy, Halogen Free�
Certificates: TS****9, ISO****1 and UL�
Price: Quite competitive especially for orders in huge quantities�
Products application: Computer, Communication, Test & Control system, Medical Equipment etc.�
Lead Time: ***0 days (Depends on Q\'ty, production status etc. )�
Delivery Mode: UPS, DHL, FedEx, TNT, standard flight & vessel�Pls kindly feel free contact with Andrew liu if you have any question about PCB&PCBA.